Enterprise PCB Design Services | IPC CID+ Certified
12+ Layers, HDI, RF Layout, Impedance Control
Design → Prototype → Production
Technical Specifications
Max Layers
12+ Layer HDI
Min Trace
3-4 mil
Impedance
Controlled Routing
DFM
First-Pass Yield Focus
RF
High-Frequency Layout
Standards
IPC Class 2/3
Our PCB design process begins with thorough schematic review and component selection optimization. Every layout follows IPC standards with DFM built into the workflow from day one.
We specialize in high-density interconnect (HDI) designs, RF layout for wireless modules, and mixed-signal routing that maintains signal integrity across complex multi-layer stackups.
Every design includes impedance-controlled routing verification, power integrity analysis, and a complete DFM report ready for your fabricator.
Tools & Technologies
Altium DesignerHDI Design RulesImpedance Calculator3D ViewerDFM Check